Thin film deposition techniques are used to deposit a wide variety of materials on the wafer surface
microfab is service provider in the field of silicon-based micro-systems technology. Our production lines, located in two cleanrooms, feature state-of-the-art facilities that permit wafers of 100 to 150mm to be processed. We can provide standard MEMS production technologies like surface micromachining, bulk micromachining, silicon deep etching (DRIE, Bosch process), wafer bonding as well as 3D microforming.
Please follow the links below to find out more about the individual manufacturing options at microfab.