Our expertise for your products

With quality as a top priority, we have achieved certification wich includes DIN EN ISO 9001:2015, regardless of wether the production volumes are large or small.
Your design of microsystems or special components serves as a basis for us to decide which production technologies are most suited to putting your ideas into practice. Our vast experience in inter-process synchronisation guarantees maximum production efficiency every time.

our fabrication services

State of the art facilities

Processing is conducted in a dedicated silicon device processing facility within a modern and qualified clean room. We are able to tailor our facility to accommodate a wide variety of customer requirements, especially for MEMS devices. We are capable of operating between 100mm and 150mm diameter wafers and can process quartz and glass wafers.
microfab holds accreditation to DIN EN ISO 9001:2015 across all of its activities.
“state-of-the-art” equipped wafer line capable of small-medium series production cleanroom area: 900m² class 10 – 1000 assembly and packaging test equipment.

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Fabrication Services

microfab is service provider in the field of silicon-based micro-systems technology. Our production lines, located in two cleanrooms, feature state-of-the-art facilities that permit wafers of 100 to 150mm to be processed. We can provide standard MEMS production technologies like surface micromachining, bulk micromachining, silicon deep etching (DRIE, Bosch process), wafer bonding as well as 3D microforming.

Please follow the links on the right to find out more about the individual manufacturing options at microfab.

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Thin Films

Thin film deposition techniques are used to deposit a wide variety of materials on the wafer surface

DIFFUSION & DOPING

Quartz furnace processes under inert gas (N2) atmosphere

LITHOGRAPHY

microfab’s Photolithography department is located in a class ISO 4 clean room cell

WET ETCHING

Wet chemical etching is commonly used for uniform stripping or patterning through a mask

Dry etching

Dry etching techniques (RIE, ion beam and plasma etching) are intensively used at microfab

DEEP TRENCHES

DRIE is a high aspect ratio, deep trench silicon etching process

WAFER BONDING

microfab is able to do direct, face-to-face bonding of silicon and glass wafers

BACK END

For prototyping and small series production microfab offers Back end services

For additional information and details, please don’t hesitate
to contact our production team.

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