Our expertise for your products

With quality as a top priority, we have achieved certification wich includes DIN EN ISO 9001:2015, regardless of wether the production volumes are large or small.
Your design of microsystems or special components serves as a basis for us to decide which production technologies are most suited to putting your ideas into practice. Our vast experience in inter-process synchronisation guarantees maximum production efficiency every time.

our fabrication services

State of the art facilities

Processing takes place in a dedicated clean room facility located in Bremen Technologiepark. We are able to tailor our production to accommodate a wide variety of customer requirements, especially for MEMS devices. We are capable of processing quartz and glass wafers in diameter between 100 mm and 150 mm. microfab holds accreditation to DIN EN ISO 9001:2015 across all of its activities.

“State-of-the-art” wafer line capable of small to medium series production. Cleanroom area: 900 m², class ISO 4 to 6. Additional dedicated labs with test, assembly & packaging equipment.

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Fabrication Services

microfab is service provider in the field of silicon-based micro-systems technology. Our production lines, located in two cleanrooms, feature state-of-the-art facilities that permit wafers of 100 to 150mm to be processed. We can provide standard MEMS production technologies like surface micromachining, bulk micromachining, silicon deep etching (DRIE, Bosch process), wafer bonding as well as 3D microforming.

Please follow the links on the right to find out more about the individual manufacturing options at microfab.


Thin film deposition techniques are used to deposit a wide variety of materials on the wafer surface


Quartz furnace processes under inert gas (N2) atmosphere


microfab’s Photolithography department is located in a class ISO 4 clean room cell


Wet chemical etching is commonly used for uniform stripping or patterning through a mask


Dry etching techniques (RIE, ion beam and plasma etching) are intensively used at microfab


DRIE is a high aspect ratio, deep trench silicon etching process


microfab is able to do direct, face-to-face bonding of silicon and glass wafers


For prototyping and small series production microfab offers Back end services

For additional information and details, please don’t hesitate
to contact our production team.

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