Wafer bonding

Full Wafer Packaging - SOI

microfab is able to do direct, face-to-face bonding of silicon and pyrex (glass) wafers. The following standard processes are available:

  • Silicon direct bonding (SDB)
  • Anodic bonding of silicon to pyrex wafers
  • Glass frit bonding
  • Eutectic bonding
  • High temperature fusion bonding of silicon wafers

Thermocompression and Anodic Bonder

The  Bonder at microfab available is a semiautomatic, computer-controlled, stand-alone substrate bonder equipped with a vacuum/pressure chamber and a loading arm. The machine processes aligned and unaligned 100 and 150mm wafers. The alignment accuracy of this tool is listed as being 3 µm (3 σ).

All bonding pair alignment is done on the Bond Alignment tool, the substrate stacks are mechanically clamped using the transport fixture, and then transported and bonded in the SB6 chamber. Triple stack bonding is possible.