microfab´s Photolithography department is located in a class ISO 4 clean room cell.
The processing of the following substrate sizes is possible:
- 100mm / round
- 150mm / round
- 4 inch / round
- 6 inch / round
- 100mm / square
- 4 inch / square
Several Automatic Cluster Systems and semi-automated spin-coaters and developers for Lithography Processes are available.
Various mask aligners for alignment & exposure are available. Backside alignment with ± 2 µm overlay accuracy is possible.
The maximum resolution of 0.8 µm lines/spaces is achieved with thin positive resist. Thick positive resist, often used for microform applications, with thicknesses up to 100 µm, are also available.
All layouts are on 5- or 7-inch chrome-on-glass masks.
Furthermore, a direct-write photolithography machine is available with the following main key features:
- 149mm x 149mm maximum writing area
- 155mm x 155mm x 7mm maximum wafer size
- 1µm and 5µm minimum feature sizes (depending on the configuration) across full writing area