Our ability to ensure quick, reliable, flexible and uncomplicated implementations of new ideas rests on our broad range of production technologies, state-of-the-art facilities and detailed process knowledge.
We provide unmatched foundation of knowledge and experience, seamless integration from design to fabrication, and Technologies unique in the MEMS world.
Bulk Micromachining (BMM) describes the fabrication process of a device taking advantage of all three space dimensions
Surface micromachining is the fabrication of micromechanical structures by deposition and etching of thin structural and sacrificial films
Surface stiction is a major problem during fabrication of MEMS components, such as silicon sensors, microactuators or microfludic devices.
microfab applies well established technologies for wafer processing and manufacturing of customer-based MEMS/microsystems, such as bulk micromachining including deep trench silicon etch DRIE, surface micromachining based on stress-controlled LPCVD layers, wafer bonding (anodic and silicon direct) or electroplating of gold and other metals and alloys. – Bulk micromachining – Advanced bulk micromachining by Deep Reactive Ion Etching DRIE (Bosch Process)Surface micromachining – based on stress-controlled poly Si and sacrificial layer etch – Surface treatment with Nanofilms
Please contact us if we are allowed to introduce our standard MEMS processes to your application.
For additional information and details, please don’t hesitate
to contact our production team.
