Laser (stealth) dicing available

18.05.2020

microfab offers a new dicing technology for fragile and sensitive MEMS structures using the stealth laser technique. Please contact us for more information.

More News

SAVE THE DATE! microfab at the Sensors Converge in Santa Clara, CA….

Visit us at the Sensors Converge in Santa Clara, USA. From 24-26 June 2024 you
read more

An Early Christmas Present….

... Today our new Heidelberg DWL 66+ Laser Writer was delivered! The DWL 66+ laser
read more