Packaged Pressure Sensor Die
The surface-mount pressure sensor comprises of a micromachined capacitive absolute pressure sensor element placed in a ceramic package. The sensor die itself is fabricated on the surface of a nonconductive substrate to lower parasitic capacitances and to increase sensitivity. The micromachining and subsequent packaging process yields a floating pressure sensitive capacitance of high electrical quality. Additional technical data on the micromachined sensor elements can be found in the datasheets E1.3N and E8.0T.
The PE1.3N/PE8.0T-3.0SQ can be treated as a standard two terminal SMD capacitor. Additional shielding contacts to the package metallization and lid should be tied to ground but are not electrically connected to the sensor element.
The sensor die-attach and environmental protection is designed for the industrial temperature range of -20°C to +85°C and operation in ambient air.
Please contact microFAB Bremen for further information on packaging options.