Processing is conducted in a dedicated class 100/1000 silicon device processing facility with a class 10 lithography clean room. We are able to tailor our facility to accommodate a wide variety of customer requirements, especially for MEMS devices. We are capable of operating between 100mm and 150mm diameter wafers and can process quartz and glass wafers.
microfab holds accreditation to DIN EN ISO 9001:2015 across all of its activities.
"state-of-the-art" equipped wafer line (100 and 150mm) capable of small-medium series production cleanroom area: 900m² class 10 - 1000 assembly and packaging test equipment
In the section download you will find a representative listing of the wide variety of foundry equipment we have installed. For more information on any of these equipments, please feel free to contact us.