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Thin films Diffusion & Doping Lithography Wet etching Dry etching Deep Trenches Wafer bonding Back end

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Silicon Oxidation

Thermal Oxidation of Silicon

CMOS-compatible quartz furnace processes (Centrotherm), try and wet oxidation 100 and 150mm wafer size, batch quantity: up to 50 wafers per run.

thickness non-uniformity across wafer: <2%
average thickness non-uniformity wafer-to-wafer: <3%
average thickness non-uniformity batch-to-batch: <5%

Printable Version

Thin films Thin film sputtering