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Low Pressure Chemical Vapor Deposition

Centrotherm furnace for up to 150mm wafers

LPCVD technology is used for uniform, double side deposition of 100 and 150mm size silicon wafers with dielectric or poly-silicon layers at moderate to high process temperatures. Processing is done in three Centrotherm furnaces with 4 tubes each. All applied standard processes are SPC monitored. The layer thickness is measured on test wafers after each run.

Currently available LPCVD thin films

Printable Version

PECVD Electroplating