Electroplating of pure metals, such as gold, nickel and copper, as well as alloys of gold and nickel are available for small quantities and R&D batches. This technique is commonly used for microforming applications (filling of high-aspect ratio resist negative forms), e.g. in the fabrication of acceleration sensors or microrelais. As a "cold process", electroplating is compatible with most CMOS processes, if applied as a back end, post process.
For example, special MEMS devices such as acceleration senosrs or gyroscopes can be added on top of finished ASIC wafers.