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MEMS Foundry


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Thin films Diffusion & Doping Lithography Wet etching Dry etching Deep Trenches Wafer bonding Back end

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Electroplating

Electroplating for small series

Electroplating with IMI systems

Electroplating of pure metals, such as gold, nickel and copper, as well as alloys of gold and nickel are available for small quantities and R&D batches. This technique is commonly used for microforming applications (filling of high-aspect ratio resist negative forms), e.g. in the fabrication of acceleration sensors or microrelais. As a "cold process", electroplating is compatible with most CMOS processes, if applied as a back end, post process.

microcoil on top

For example, special MEMS devices such as acceleration senosrs or gyroscopes can be added on top of finished ASIC wafers.

Printable Version

LPCVD Polymere Coating